Topic: ADAS (Advanced Driver Assistance Systems) Simulation: Exceeding the Customer Requirements Event Date: 12 June 2020 Event Time: 10:00AM-11:00AM EDT Speaker Details: Kevin Martin Supervisor, ADAS Simulation Assisted Driving, Ford Motor Company. Registration Link: https://www.eventbrite.com/e/adasadvanced-driver-assistance-systems-simulation-webinar-tickets-107128977656
Topic: A Gentle Introduction to Reinforcement Learning and its Applications Event Date: 4 September 2020 Event Time: 11:00AM-12:00PM EDT Speaker Details: Matthew E. Taylor Director, Intelligent Robot Learning Lab (IRL Lab) Associate Professor, Computing Science at the University of Alberta Fellow, Alberta Machine Intelligence Institute Registration Link: https://www.eventbrite.ca/e/a-gentle-introduction-to-reinforcement-learning-and-its-applications-tickets-118158201361
IEEE WIE Windsor section in collaboration with IEEE WIE Winnipeg is going to hold an online workshop with the title of “How to Use LaTeX to Draft a Journal Paper” on May 28th (Friday) from 2:00 pm to 3:00 pm EST on Microsoft Teams with “Dr. Marzieh Eini Keleshteri” as our guest speaker. Dr. Keleshteri received her Ph.D. in mathematics from Eastern Mediterranean University, North Cyprus in 2015, and Currently, she is a Ph.D. candidate in electrical engineering at the University of Manitoba. She has acted as the vice-chair of the IEEE Women in Engineering (WIE), Winnipeg section since September 2019. She has been an active LaTeX user since 2006. Covered Subjects: During this two-hour long workshop, you will learn how to - create a LaTeX document and define a preamble from scratch - add and use proper packages - add figures and create tables - set margins, headers, and footnotes and create frontmatter for your paper draft - insert equations, label, and reference them and keep them organized by numbering - cite references and create a bibliography using BibTeX - and more! We highly encourage you to attend this workshop and learn LaTex to write papers, lab reports, theses, and books simpler, and more visually appealing. Some Amazon gift cards will be awarded to randomly selected attendees. Please register for the workshop by using the following link: https://events.vtools.ieee.org/m/272709 Gain access to the Teams by: https://teams.microsoft.com/l/meetup-join/19%3ameeting_NDc2ZmIwMmYtMzkyZC00NzA0LTg1MjctZTNjNGQwZjgxNWM4%40thread.v2/0?context=%7b%22Tid%22%3a%2212f933b3-3d61-4b19-9a4d-689021de8cc9%22%2c%22Oid%22%3a%228e7dca5d-56b7-463e-b454-c8e4c5e8f16d%22%7d
To discuss the events of the past months and plan the upcoming month.
This competition aims to offer students an opportunity to exercise and improve their problem solving, analytical, programming, and technical writing skills. Only undergraduate and graduate students of the University of Windsor are eligible to participate in the competition. Instructions for participation: Interested students should register for the event and download the challenge dataset from the link, to solve a multi-label classification problem, where each sample of data has two labels. The solution must be based on deep learning; however, participants are free to use any deep learning algorithm of their choice or even propose their own architecture. The data is imbalanced and can be processed as desired. Further instructions about this project are given on the second page of the event poster. Each participant then requires to submit a report by sending a PDF file along with the zipped project file to “firstname.lastname@example.org”, until July 15, 2021, indicating in the email subject “CISSMC Challenge”. The report should contain the name and student ID of the participant, and the project file should contain the source code and a file containing the predicted labels. The submitted reports and the project codes will be evaluated after the submission deadline. Only the shortlisted participants will be contacted once all submissions are reviewed. IEEE CIS/SMC Chapter offers the following awards: Winner for the best solution – Certificate + 500CAD gift card 2nd best solution – Certificate + 300CAD gift card 3rd best solution – Certificate + 200CAD gift card
Invitation to Attend “Integration of Terrestrial Networks and Extreme Environments: Challenges and Capabilities" IEEE ComSoc Chapter, Windsor Section is going to hold an event co-hosting with the NY section. The event information can be found below. Speaker: Mehdi Rahmati, Assistant Professor, Department of Electrical Engineering & Computer Science, Cleveland State University, Cleveland, OH 44115, USA Cost: The virtual event is free to attend. Registration: Please register for the event at https://events.vtools.ieee.org/m/308383 by March 28, 2022 Agenda: 06:45 PM - 07:00 PM Connecting to the ZOOM meeting 07:00 PM - 07:05 PM Welcoming & IEEE ComSoc Membership Promotion 07:05 PM - 07:10 PM Speaker Introduction 07:10 PM - 07:55 PM Presentation 07:55 PM - 08:10 PM Questions and Answers 08:10 PM - 08:15 PM Closing Remarks Abstract: With the phenomenal growth of excessive data traffic and the increasing number of connected devices, existing communications solutions are posing unprecedented challenges in terms of capacity, latency, heterogeneity, mobility, coverage, energy efficiency, and reliability. Given the demand for full connectivity, as part of the post 5G era, non-terrestrial and terrestrial networks integration will be a challenging mission that will necessitate redefining a multi-dimensional and fully orchestrated system in terms of sensing, communications, computing, and intelligence. In this talk, I will present non-conventional approaches to address the problems in a non-terrestrial and extreme environment, i.e., underwater. Intelligent and behavior-aware probabilistic solutions will be discussed, with the goal of achieving robust adaptation in terms of required Quality of Service and Quality of Experience to meet the demands in a variety of scenarios. Speaker Bio: Dr. Mehdi Rahmati (IEEE Senior Member) is an assistant professor in the Department of Electrical Engineering and Computer Science at Cleveland State University in Ohio. His research is in the areas of wireless communications, underwater communications, and coordination in distributed autonomous systems. He received his PhD in Electrical and Computer Engineering in 2020 from Rutgers University in New Jersey. He has published numerous peer-reviewed papers and has received many prestigious awards, including the IEEE Oceanic Engineering Society Young Professional Award in 2022 and 2023, the best demo award at the 2019 IEEE International Conference on Sensing, Communication, and Networking (SECON), the first prize in the 2019 IEEE Communication Society (ComSoc) student competition, the best paper award at the 2017 IEEE International Conference on Mobile Ad-hoc and Sensor Systems (MASS), and the best paper runner-up award at the 2015 ACM International Conference on Underwater Networks and Systems (WUWNet).
The tutorial session is intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). This lecture is broken up into 3 sections in order to achieve the following learning outcomes: 1. Advantages and disadvantages of PCB design vs. conventional circuit prototyping methods. 2. The PCB fabrication process. 3. Develop a library of parts including the schematic symbol, 2D PCB footprint, and 3D package design. 4. Convert a circuit schematic into a PCB design to be sent to the manufacturer for fabrication. 5. 3D render PCB Design. Please register from the link provided below: https://events.vtools.ieee.org/m/314638 You can join either in person in CEI2105 or virtually by clicking here or copy and paste the link below in your browser: https://teams.microsoft.com/l/meetup-join/19%3ameeting_ZTMzMzI2YjAtNDdjMS00YjQ1LTgxZjYtZjA4ZDRmNjM0MjU3%40thread.v2/0?context=%7b%22Tid%22%3a%2212f933b3-3d61-4b19-9a4d-689021de8cc9%22%2c%22Oid%22%3a%22af1b3281-eae1-430a-bd15-5b40ef08dece%22%7d
3D modeling is an extremely useful technical skill for engineers from all disciplines. This tutorial focuses on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360 is a cloud-based platform that is free for all students. It integrates seamlessly with Eagle PCB design software. Please register from the link provided below: https://events.vtools.ieee.org/m/315238 You can join virtually by clicking here or copy and paste the link below in your browser: https://teams.microsoft.com/l/meetup-join/19%3ameeting_YzIzOGI2ZDItMmNiYi00Nzg2LWI1MzEtNjJkMjIwNDllZGM2%40thread.v2/0?context=%7b%22Tid%22%3a%2212f933b3-3d61-4b19-9a4d-689021de8cc9%22%2c%22Oid%22%3a%22af1b3281-eae1-430a-bd15-5b40ef08dece%22%7d
The University of Windsor has recently procured several machines capable of fabricating dual layer PCBs complete with through-hole plating, solder mask, silk screen and solder paste deposition. The newly constructed PCB Fabrication lab s a valuable asset for engineering student clubs, capstone students, researchers and electrical hobbyists. This lab is located in CEI2205 and is available to all undergraduate engineering students free of charge. The purpose of this event is to introduce and familiarize all attendees with the PCB fabrication equipment to advance their circuit design and fabrication skillset. Drop by CEI2205 any time between 10:00 am and 12:00 pm to learn about this exciting new lab equipment. Please register through the link below before attending. https://events.vtools.ieee.org/m/315169
Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addresses the knowledge and techniques required to produce high-quality manually soldered joints. Eric Pillon and Jake Blythe will provide an overview of basic manual soldering equipment and proper safety precautions for soldering. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components will be discussed in this event. Registration link: https://events.vtools.ieee.org/m/315172