IEEE Windsor Section

IEEE
June 19th, 2022

Date: June 17, 2022

Location: CEI Courtyard

Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addressed the knowledge and techniques required to produce high-quality manually soldered joints. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components discussed in this event.


June 17th, 2022

Date: 10 June 2022

Location: CEI2205

The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste deposition. The newly constructed PCB Fabrication lab is a valuable asset for engineering student clubs, capstone students, researchers, and electrical hobbyists. This lab is located in CEI2205 and is available to all undergraduate engineering students free of charge.

The purpose of this event was to introduce and familiarize all attendees with the PCB fabrication equipment to advance their circuit design and fabrication skillset.


June 17th, 2022

Date: 3 June 2022

Location: Online

This tutorial focused on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360 is a cloud-based platform that is free for all students. It integrates seamlessly with Eagle PCB design software.

Our session covered the following topics:

  • How to create an Autodesk account & download Fusion 360 with a free Education License
  • How to navigate Fusion 360 and its different workspaces
  • Keyboard Shortcuts/Hot Keys
  • How to Constrain Sketches
  • An Intro to Assemblies & Joints
  • How to model an enclosure for a custom printed circuit board (PCB) and other design demos
  • A Design Guide for 3D Printing
  • How Fusion 360 Compares to Autodesk Inventor (used in industry) and other free CAD software available to students

The event recording can be found in the link provided below:

Fusion 360 – 3D Modelling Tutorial-20220603_100656-Meeting Recording (1).mp4


May 29th, 2022

Date: 27 May 2022

Location: CEI building

The tutorial session was intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). The lecture was broken up into 3 sections in order to achieve the following learning outcomes:

1. Advantages and disadvantages of PCB design vs. conventional circuit prototyping methods.

2. The PCB fabrication process.

3. Develop a library of parts including the schematic symbol, 2D PCB footprint, and 3D package design.

4. Convert a circuit schematic into a PCB design to be sent to the manufacturer for fabrication.

5. 3D render PCB Design.


March 28th, 2022

Date: 24 Mar 2022

Location: CEI building

Description: Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addressed the knowledge and techniques required to produce high-quality manually soldered joints. Eric Pillon and Jake Blythe provided an overview of basic manual soldering equipment and proper safety precautions for soldering. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components discussed in this event.


March 24th, 2022

Date: 29 Mar 2022

Location: Online

IEEE ComSoc Chapter, Windsor Section is going to hold an event co-hosting with the NY section titled “Integration of Terrestrial Networks and Extreme Environments: Challenges and Capabilities”.

Speaker: Dr. Mehdi Rahmati, Assistant Professor, Department of Electrical Engineering & Computer Science, Cleveland State University, Cleveland, OH 44115, USA

Registration: Please register for the event at: https://events.vtools.ieee.org/m/308383 by March 28, 2022.

The event information can be found at:  https://windsor.ieee.ca/event/integration-of-terrestrial-networks-and-extreme-environments-challenges-and-capabilities


May 29th, 2021

Date: 28 May 2021

Location: On-line

Description: Dr. Keleshteri (Ph.D Mathematics) who is currently, is a Ph.D. candidate in electrical engineering at the University of Manitoba and has acted as the vice-chair of the IEEE Women in Engineering (WIE), Winnipeg section since September 2019, gave this two-hour long workshop, on How to Use LaTeX to Draft a Journal Paper.


May 29th, 2021

Date: 18 May 2021

Location: On-line

Description: Prof. Feifei Gao, Associate Professor, IEEE Fellow, Department of Automation, Tsinghua University, China, presented a seminar talking about how to apply the deep neural network (DNN) for various aspects of physical layer communications design, including the channel estimation, channel prediction, channel feedback, data detection, and beamforming, etc. We will also present a promising new approach that is driven by both the communications data and the communication models.


May 29th, 2021

Date: 16 May 2021

Location: On-line

Description: The IEEE Windsor Student branch partnered with Vincent Massey to hold a 7-week online hackathon for students grades 7-12 of  to participate in a web development challenge to develop a website which can help students to study and work more effectively and efficiently!


May 29th, 2021

Date: April 29, 2021

Location: On-line

Description: Dr. Yahyaie, currently the director of Mitacs, working with industry and academic partners to advance Canada’s innovation ecosystem gave an online seminar on transitioning from Academia to Industry.