IEEE Windsor Section

November 2nd, 2022

The upcoming event “AI in 6G Networks – Path From Enabler to AI Native Air Interface” will be held on Friday, 10 November 2022, co-hosted by IEEE Windsor Section Joint Chapter SP01/COM19.

For registration and more information, please visit:


Machine learning (ML) and AI will play a key role in the development of 6G networks. Network virtualization and network softwarization solutions in 5G networks can support data-driven intelligent and automated networks to some extent and this trend will grow in 5G-advanced networks. Radio access network algorithms and radio resource management functions can exploit network intelligence to fine tune network parameters to reach close-to-optimal performance in 5G networks. In 6G networks, network intelligence is envisioned to be end-to-end, and air interface is envisioned to be AI-native. The user equipment (UE) devices need to be smarter, environment and context aware, and capable of running ML algorithms. This talk will focus on the main practical challenges in developing machine learning solutions in 5G use cases and emphasize with a case study how deployment of these solutions is much harder in a live network as compared to theoretical performance evaluation. Further, a vision for paradigm shift from AI-as-an-enabler to AI-Native air-interface will be provided for 6G networks.

Speaker: Dr. Majid of Nokia Bell Labs


M. Majid Butt received the M.Sc. degree in digital communications from Christian Albrechts University, Kiel, Germany, in 2005, and the Ph.D. degree in telecommunications from the Norwegian University of Science and Technology, Trondheim, Norway, in 2011. He is a senior research specialist at Nokia Bell Labs, France, and an adjunct Research Professor at Trinity College Dublin, Dublin, Ireland. Prior to that, he has held various positions at the University of Glasgow, U.K., Trinity College Dublin, Ireland, and Fraunhofer HHI, Germany. His current research interests include communication techniques for wireless networks with a focus on radio resource allocation, scheduling algorithms, energy efficiency, and machine learning for RAN. He has authored more than 75 peer-reviewed conference and journal articles, 4 book chapters and filed over 30 patents in these areas. He frequently gives invited and technical tutorial talks on various topics in IEEE conferences including, ICC, Globecom, VTC, etc.

Dr. Butt was a recipient of the Marie Curie Alain Bensoussan Post-Doctoral Fellowship from the European Research Consortium for Informatics and Mathematics. He has organized several technical workshops on various aspects of communication systems in conjunction with major IEEE conferences. He serves as an associate editor for IEEE Communication Magazine, IEEE Open Journal of the Communication Society and IEEE Open Journal of Vehicular Technology.

August 28th, 2022


Austin ComSoc/SP/CtSoc and Computer/EMBS  joint chapters would like to invite you to attend a special VDL talk on “AI Based Zero Energy Communication in 6G” on September 21st, 2022.


Prof. Sinem Coleri, Koc University (Turkey)



Supporting low- or zero-energy machine type devices through the incorporation of energy harvesting technologies in 6G is expected to reduce frequent battery replacements as well as sustaining the operation of battery-less devices. The nodes can harvest energy from natural sources, such as sun, vibration and pressure; inductive and magnetic coupling; and radio frequency (RF) based wireless energy transfer. The complexity of the integration of energy harvesting into communication system design is increasing with the wide variety of the requirements of massive machine type communication scenarios in terms of reliability, delay and throughput. This high complexity can only be handled by the usage of AI techniques to continuously monitor the system knowledge and update the optimal communication and energy harvesting parameters accordingly. In this talk, novel optimal resource allocation algorithms are presented for low- or zero-energy machine type devices based on the usage of AI techniques. The wireless communication network and energy harvesting parameters are mapped to the optimal resource allocation by using deep neural networks.



Sinem Coleri is Professor in the department of Electrical and Electronics Engineering at Koc University. She is also the founding director of Wireless Networks Laboratory (WNL). Her research interests are in wireless communications and networking with applications in machine-to-machine communication, sensor networks and intelligent transportation systems.

Sinem Coleri received the BS degree in electrical and electronics engineering from Bilkent University in 2000, the M.S. and Ph.D. degrees in electrical engineering and computer sciences from University of California Berkeley in 2002 and 2005. She worked as a research scientist in Wireless Sensor Networks Berkeley Lab under sponsorship of Pirelli and Telecom Italia from 2006 to 2009. Since September 2009, she has been a faculty member in the department of Electrical and Electronics Engineering at Koc University.

Dr. Coleri has more than 180 peer-reviewed publications with citations over 8900 (Google scholar profile). She has received numerous awards and recognitions, including TUBITAK (The Scientific and Technological Research Council of Turkey) Incentive Award and IEEE Vehicular Technology Society 2020 Neal Shepherd Memorial Best Propagation Paper Award in 2020, College of Engineering Outstanding Faculty Award at Koc University and IEEE Communications Letters Exemplary Editor Award as Area Editor in 2019, Turkish Academy of Sciences Distinguished Young Scientist (TUBA-GEBIP) in 2015.

Dr. Coleri has been Area Editor of IEEE Communications Letters and IEEE Open Journal of the Communications Society since 2019, Editor of IEEE Transactions on Vehicular Technology since 2016 and Senior Editor of IEEE Access since 2022. She is an IEEE Fellow.


Registration link:

Zoom info will be issued to all that registered.


For any additional information, please send an email to

F. Behmann at

August 6th, 2022

Date: August 4th, 2022

Location: CEI 1101

MAGNA is one of the largest automotive suppliers in the world since 1957. A big Tech Talk event was hosted by the IEEE Student Branch jointly with CAS. 5 engineers were invited to discuss their recruitment journey in Magna and share their valuable experience with us. There were some Human Resource directors who could address all the attendees’ questions regarding job matters. A recruitment link was provided for attendees on the day of the event to upload their resumes to join the MAGNA talent community.

Speakers for the Tech Talk & Recruitment Event were:

Victoria Shkreli Pacilli, Senior Engineer / Business Technical Analyst in the Innovation Outreach Team at Magna International.

Jennie Ecclestone, Director, Recruitment Marketing and Employer Brand at Magna International.

Jim Quesenberry, Director of Research and Development.

Philip Korta, Senior Power Electronics Engineer.

August 1st, 2022

Date: Aug 4, 2022, 2 PM to 5 PM

Location: CEI 1101

Registration link:

July 21st, 2022

Date: July 21, 2022

Location: CEI Industrial Courtyard

At this event, Markforged, one of the biggest industrial additive manufacturers, presented some of their products and provided a tech talk on 3D printers and printing materials.  There was a Q&A session and the attendees’ inquiries were answered.

July 16th, 2022

Registration link:

June 19th, 2022

Date: June 17, 2022

Location: CEI Courtyard

Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addressed the knowledge and techniques required to produce high-quality manually soldered joints. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components discussed in this event.

June 17th, 2022

Date: 10 June 2022

Location: CEI2205

The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste deposition. The newly constructed PCB Fabrication lab is a valuable asset for engineering student clubs, capstone students, researchers, and electrical hobbyists. This lab is located in CEI2205 and is available to all undergraduate engineering students free of charge.

The purpose of this event was to introduce and familiarize all attendees with the PCB fabrication equipment to advance their circuit design and fabrication skillset.

June 17th, 2022

Date: 3 June 2022

Location: Online

This tutorial focused on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360 is a cloud-based platform that is free for all students. It integrates seamlessly with Eagle PCB design software.

Our session covered the following topics:

  • How to create an Autodesk account & download Fusion 360 with a free Education License
  • How to navigate Fusion 360 and its different workspaces
  • Keyboard Shortcuts/Hot Keys
  • How to Constrain Sketches
  • An Intro to Assemblies & Joints
  • How to model an enclosure for a custom printed circuit board (PCB) and other design demos
  • A Design Guide for 3D Printing
  • How Fusion 360 Compares to Autodesk Inventor (used in industry) and other free CAD software available to students

The event recording can be found in the link provided below:

Fusion 360 – 3D Modelling Tutorial-20220603_100656-Meeting Recording (1).mp4

May 29th, 2022

Date: 27 May 2022

Location: CEI building

The tutorial session was intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). The lecture was broken up into 3 sections in order to achieve the following learning outcomes:

1. Advantages and disadvantages of PCB design vs. conventional circuit prototyping methods.

2. The PCB fabrication process.

3. Develop a library of parts including the schematic symbol, 2D PCB footprint, and 3D package design.

4. Convert a circuit schematic into a PCB design to be sent to the manufacturer for fabrication.

5. 3D render PCB Design.