Date: August 4th, 2022

Location: CEI 1101

MAGNA is one of the largest automotive suppliers in the world since 1957. A big Tech Talk event was hosted by the IEEE Student Branch jointly with CAS. 5 engineers were invited to discuss their recruitment journey in Magna and share their valuable experience with us. There were some Human Resource directors who could address all the attendees’ questions regarding job matters. A recruitment link was provided for attendees on the day of the event to upload their resumes to join the MAGNA talent community.

Speakers for the Tech Talk & Recruitment Event were:

Victoria Shkreli Pacilli, Senior Engineer / Business Technical Analyst in the Innovation Outreach Team at Magna International.

Jennie Ecclestone, Director, Recruitment Marketing and Employer Brand at Magna International.

Jim Quesenberry, Director of Research and Development.

Philip Korta, Senior Power Electronics Engineer.

Date: July 21, 2022

Location: CEI Industrial Courtyard

At this event, Markforged, one of the biggest industrial additive manufacturers, presented some of their products and provided a tech talk on 3D printers and printing materials.  There was a Q&A session and the attendees’ inquiries were answered.

Date: June 17, 2022

Location: CEI Courtyard

Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addressed the knowledge and techniques required to produce high-quality manually soldered joints. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components discussed in this event.

Date: 10 June 2022

Location: CEI2205

The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste deposition. The newly constructed PCB Fabrication lab is a valuable asset for engineering student clubs, capstone students, researchers, and electrical hobbyists. This lab is located in CEI2205 and is available to all undergraduate engineering students free of charge.

The purpose of this event was to introduce and familiarize all attendees with the PCB fabrication equipment to advance their circuit design and fabrication skillset.

Date: 3 June 2022

Location: Online

This tutorial focused on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360 is a cloud-based platform that is free for all students. It integrates seamlessly with Eagle PCB design software.

Our session covered the following topics:

• How to create an Autodesk account & download Fusion 360 with a free Education License
• How to navigate Fusion 360 and its different workspaces
• Keyboard Shortcuts/Hot Keys
• How to Constrain Sketches
• An Intro to Assemblies & Joints
• How to model an enclosure for a custom printed circuit board (PCB) and other design demos
• A Design Guide for 3D Printing
• How Fusion 360 Compares to Autodesk Inventor (used in industry) and other free CAD software available to students

The event recording can be found in the link provided below:

Fusion 360 – 3D Modelling Tutorial-20220603_100656-Meeting Recording (1).mp4

Date: 27 May 2022

Location: CEI building

The tutorial session was intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). The lecture was broken up into 3 sections in order to achieve the following learning outcomes:

1. Advantages and disadvantages of PCB design vs. conventional circuit prototyping methods.

2. The PCB fabrication process.

3. Develop a library of parts including the schematic symbol, 2D PCB footprint, and 3D package design.

4. Convert a circuit schematic into a PCB design to be sent to the manufacturer for fabrication.

5. 3D render PCB Design.

Date: 24 Mar 2022

Location: CEI building

Description: Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addressed the knowledge and techniques required to produce high-quality manually soldered joints. Eric Pillon and Jake Blythe provided an overview of basic manual soldering equipment and proper safety precautions for soldering. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components discussed in this event.