Author: Erfan Sadeghi
Soldering Workshop
Date: June 17, 2022 Location: CEI Courtyard Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt… Read more
PCB Fabrication Lab Tutorial
Date: 10 June 2022 Location: CEI2205 The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste… Read more
Fusion 360 3D Modelling Tutorial
Date: 3 June 2022 Location: Online This tutorial focused on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360… Read more
Eagle PCB Design Tutorial
Date: 27 May 2022 Location: CEI building The tutorial session was intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). The lecture was… Read more
Soldering Workshop
Date: 24 Mar 2022 Location: CEI building Description: Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to… Read more
Invitation to Attend “Integration of Terrestrial Networks and Extreme Environments: Challenges and Capabilities”
Date: 29 Mar 2022 Location: Online IEEE ComSoc Chapter, Windsor Section is going to hold an event co-hosting with the NY section titled “Integration of Terrestrial Networks and Extreme Environments:… Read more