Date: August 4th, 2022
Location: CEI 1101
MAGNA is one of the largest automotive suppliers in the world since 1957. A big Tech Talk event was hosted by the IEEE Student Branch jointly with CAS. 5 engineers were invited to discuss their recruitment journey in Magna and share …
Date: Aug 4, 2022, 2 PM to 5 PM
Location: CEI 1101
Registration link:
https://events.vtools.ieee.org/event/register/320892
Date: July 21, 2022
Location: CEI Industrial Courtyard
At this event, Markforged, one of the biggest industrial additive manufacturers, presented some of their products and provided a tech talk on 3D printers and printing materials. There was a Q&A session and the attendees’ inquiries were answered.
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Registration link:
https://events.vtools.ieee.org/m/319578
Date: June 17, 2022
Location: CEI Courtyard
Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although …
Date: 10 June 2022
Location: CEI2205
The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste deposition. The newly constructed PCB Fabrication lab is a valuable asset for engineering student clubs, capstone students, …
Date: 3 June 2022
Location: Online
This tutorial focused on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360 is a cloud-based platform that is free for all students. It integrates seamlessly with Eagle PCB design …
Date: 27 May 2022
Location: CEI building
The tutorial session was intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). The lecture was broken up into 3 sections in order to achieve the following learning outcomes:
1. Advantages and disadvantages of PCB design vs. conventional …
Date: 24 Mar 2022
Location: CEI building
Description: Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. …
Date: 29 Mar 2022
Location: Online
IEEE ComSoc Chapter, Windsor Section is going to hold an event co-hosting with the NY section titled “Integration of Terrestrial Networks and Extreme Environments: Challenges and Capabilities”.
Speaker: Dr. Mehdi Rahmati, Assistant Professor, Department of Electrical Engineering & Computer Science, Cleveland State …
