Date: 10 June 2022

Location: CEI2205

The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste deposition. The newly constructed PCB Fabrication lab is a valuable asset for engineering student clubs, capstone students, researchers, and electrical hobbyists. This lab is located in CEI2205 and is available to all undergraduate engineering students free of charge.

The purpose of this event was to introduce and familiarize all attendees with the PCB fabrication equipment to advance their circuit design and fabrication skillset.