Magna Tech Talk
Date: Aug 4, 2022, 2 PM to 5 PM
Location: CEI 1101
Registration link:
Markforged Tech Talk
Date: July 21, 2022
Location: CEI Industrial Courtyard
At this event, Markforged, one of the biggest industrial additive manufacturers, presented some of their products and provided a tech talk on 3D printers and printing materials. There was a Q&A session and the attendees’ inquiries were answered.
Interested in seeing some 3D printers?
Registration link:
Soldering Workshop
Date: June 17, 2022
Location: CEI Courtyard
Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addressed the knowledge and techniques required to produce high-quality manually soldered joints. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components discussed in this event.
PCB Fabrication Lab Tutorial
Date: 10 June 2022
Location: CEI2205
The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste deposition. The newly constructed PCB Fabrication lab is a valuable asset for engineering student clubs, capstone students, researchers, and electrical hobbyists. This lab is located in CEI2205 and is available to all undergraduate engineering students free of charge.
The purpose of this event was to introduce and familiarize all attendees with the PCB fabrication equipment to advance their circuit design and fabrication skillset.
Fusion 360 3D Modelling Tutorial
Date: 3 June 2022
Location: Online
This tutorial focused on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360 is a cloud-based platform that is free for all students. It integrates seamlessly with Eagle PCB design software.
Our session covered the following topics:
- How to create an Autodesk account & download Fusion 360 with a free Education License
- How to navigate Fusion 360 and its different workspaces
- Keyboard Shortcuts/Hot Keys
- How to Constrain Sketches
- An Intro to Assemblies & Joints
- How to model an enclosure for a custom printed circuit board (PCB) and other design demos
- A Design Guide for 3D Printing
- How Fusion 360 Compares to Autodesk Inventor (used in industry) and other free CAD software available to students
The event recording can be found in the link provided below:
Fusion 360 – 3D Modelling Tutorial-20220603_100656-Meeting Recording (1).mp4
Eagle PCB Design Tutorial
Date: 27 May 2022
Location: CEI building
The tutorial session was intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). The lecture was broken up into 3 sections in order to achieve the following learning outcomes:
1. Advantages and disadvantages of PCB design vs. conventional circuit prototyping methods.
2. The PCB fabrication process.
3. Develop a library of parts including the schematic symbol, 2D PCB footprint, and 3D package design.
4. Convert a circuit schematic into a PCB design to be sent to the manufacturer for fabrication.
5. 3D render PCB Design.
Soldering Workshop
Date: 24 Mar 2022
Location: CEI building
Description: Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although most soldering is automated today, manual soldering is an important skill for assembly technicians, researchers, students, and engineers. This solder training workshop class addressed the knowledge and techniques required to produce high-quality manually soldered joints. Eric Pillon and Jake Blythe provided an overview of basic manual soldering equipment and proper safety precautions for soldering. Different soldering alloys, including lead-free solders and also the proper soldering techniques for joining PCB components discussed in this event.
Invitation to Attend “Integration of Terrestrial Networks and Extreme Environments: Challenges and Capabilities”
Date: 29 Mar 2022
Location: Online
IEEE ComSoc Chapter, Windsor Section is going to hold an event co-hosting with the NY section titled “Integration of Terrestrial Networks and Extreme Environments: Challenges and Capabilities”.
Speaker: Dr. Mehdi Rahmati, Assistant Professor, Department of Electrical Engineering & Computer Science, Cleveland State University, Cleveland, OH 44115, USA
Registration: Please register for the event at: https://events.vtools.ieee.org/m/308383 by March 28, 2022.
The event information can be found at: https://windsor.ieee.ca/event/integration-of-terrestrial-networks-and-extreme-environments-challenges-and-capabilities
How to Use LaTeX to Draft a Journal Paper
Date: 28 May 2021
Location: On-line
Description: Dr. Keleshteri (Ph.D Mathematics) who is currently, is a Ph.D. candidate in electrical engineering at the University of Manitoba and has acted as the vice-chair of the IEEE Women in Engineering (WIE), Winnipeg section since September 2019, gave this two-hour long workshop, on How to Use LaTeX to Draft a Journal Paper.
