IEEE Windsor Section


Technical Talk

IEEE Computer Society South East Michigan Section presents

“Test Methods for Thermal Measurement, Reliabilty and Quality”

Abstract: From multi-core chips in slim smartphone devices or compact packaging of power semiconductor modules for lightweight electric vehicle inverters, understanding semiconductor package heat dissipation remains important for performance and product reliability purposes. This presentation introduces electrical test methods covered by JEDEC 51-1 standards. By utilizing this approach, the difficulties and problems measuring temperature at the component’s die are overcome.

Speaker: Joe Proulx, Senior Application Engineer

Speaker Bio: Joe has over 20+ years of experience as thermal engineer in industry. He has extensive CFD experience for electronics cooling analysis, and more than 7+ years specializing in thermal test measurement of semiconductors & reliability. Joe has several patents pending. He also regularly contributes to IEEE & SAE conference papers for power electronics reliability and electronics thermal simulation.

Date: March 29th 2018

Time: 6-8 PM EDT/EST

Location: Room, 254 Engineering Center Oakland University Rochester, MI 48309

Please click here to register for the event!