Date: October 4th and 5th, 2023
Location: CEI 3000, University of Windsor
At this captivating event, we introduced participants to the fascinating world of IoT, its protocols, and cutting-edge technologies. Attendees were equipped with IoT kits and guided through the process of developing firmware for IoT integration, leveraging …
Date: August 4th, 2022
Location: CEI 1101
MAGNA is one of the largest automotive suppliers in the world since 1957. A big Tech Talk event was hosted by the IEEE Student Branch jointly with CAS. 5 engineers were invited to discuss their recruitment journey in Magna and share …
Date: July 21, 2022
Location: CEI Industrial Courtyard
At this event, Markforged, one of the biggest industrial additive manufacturers, presented some of their products and provided a tech talk on 3D printers and printing materials. There was a Q&A session and the attendees’ inquiries were answered.
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Date: June 17, 2022
Location: CEI Courtyard
Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. Although …
Date: 10 June 2022
Location: CEI2205
The University of Windsor has recently procured several machines capable of fabricating dual-layer PCBs complete with through-hole plating, solder mask, silk screen, and solder paste deposition. The newly constructed PCB Fabrication lab is a valuable asset for engineering student clubs, capstone students, …
Date: 3 June 2022
Location: Online
This tutorial focused on employing Autodesk Fusion 360 to design 3D enclosures which can be printed in the PCB fabrication lab in CEI2205. Fusion 360 is a cloud-based platform that is free for all students. It integrates seamlessly with Eagle PCB design …
Date: 27 May 2022
Location: CEI building
The tutorial session was intended to walk students through the PCB design process using the Autodesk Suite (Eagle and Fusion 360). The lecture was broken up into 3 sections in order to achieve the following learning outcomes:
1. Advantages and disadvantages of PCB design vs. conventional …
Date: 24 Mar 2022
Location: CEI building
Description: Soldering is a joining method used for a wide range of parts, including delicate electronic components. Solder is a metal alloy designed to melt at very low temperatures, and various methods of soldering can be used to join parts together. …
Date: 28 May 2021
Location: On-line
Description: Dr. Keleshteri (Ph.D Mathematics) who is currently, is a Ph.D. candidate in electrical engineering at the University of Manitoba and has acted as the vice-chair of the IEEE Women in Engineering (WIE), Winnipeg section since September 2019, gave this two-hour long …
Date: 18 May 2021
Location: On-line
Description: Prof. Feifei Gao, Associate Professor, IEEE Fellow, Department of Automation, Tsinghua University, China, presented a seminar talking about how to apply the deep neural network (DNN) for various aspects of physical layer communications design, including the channel estimation, channel prediction, channel …
